|
Microvia
Stencil
Backplane
Conventional PCB
|
Microvia Capability
| 2012 |
| Build up Materials |
Aramid, BT, FR4, LD Prepreg, RCC |
Structure
- Sequential Build-up
- Sequential Lamination |
Up to 3+N+3 with IVH
Up to 3 X IVH (microvia) |
| Minimum Line Width/ Spacing |
3 mil/ 3 mil
(3/4 mil for via filling design) |
| Minimum/ Maximum Laser Via Size |
2 mil/ 8 mil |
| Laser Via Formation Method |
Conformal Mask, Direct Drilling |
| Laser Via Filling |
Copper Plating |
| Aspect Ratios |
1:1 |
| Impedance Control |
+/- 7% |
|
|
Stencil
Chemical Etched Stencil
Laser Stencil
Glue Stencil
0.1mm ,0.12mm ,0.13mm ,0.15mm ,0.18mm ,0.2mm
| Frame Dimension |
Effective Dimension |
| 55cm×65cm |
33cm×43cm |
| 42cm×52cm |
23cm×33cm |
| 37cm×47cm |
18cm×29cm |
| 30cm×40cm |
10cm×20cm |
Gerber file ,PROTEL99SE Altium Designer PADS Sprint-layout .
Backplane
| 2012 |
| Layer Count |
Up to 46 Layers |
| Minimum Line Width/ Space |
3mil / 3mil |
| Aspect Ratio |
20:1 |
| Thickness Tolerance |
+/- 8% |
| Minimum Core Thickness |
2 mil |
| Copper Foil |
1/3oz to 5oz |
| Maximum Panel size |
24 " X 36 " |
| Maximum Board Thickness |
250 mil |
| Press fit hole tolerance |
+/- 2 mil |
| Impedance Control |
+/- 5% |
|
|
Conventional PCB
| 2012 |
| Layer Count |
Rigid PCB from 2L to 46L |
| Base Materials |
FR-4, High Tg FR-4, BT, Rogers, Getek, Thermount, PTFE, Hybrid, Halogen free, Lead-free, Anti-CAF, Nelco-13, Arlon, High Speed/ Low Loss |
| Minimum Core Thickness |
2 mil |
| Copper Foil |
1/3 oz to 5 oz |
| Surface Finish |
Lead-free HASL, OSP, ENIG, Immersion Tin, Immersion Silver, Selective OSP/ ENIG, Electrolytic Gold, Carbon Ink |
| Minimum Hole Size |
6 mil |
| Minimum Line Width/ Space |
3 mil/ 3 mil |
| Solder Mask |
Photo imageable, Peelable type |
| Impedance Control |
+/- 7%
|
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